| 1. | When tlp bonding with proper pressure , the oxidation on the surface of al mmcs was n ' t the primary effect of the properties of the joint
采用适当的压力进行瞬间液相连接时，铝基复合材料表面的氧化膜已不是影响接头性能的主要因素。 |
| 2. | It ' s the first time to deposit copper film on surface of al mmcs by magnetron sputtering , and embed al mmcs into the sputtering region of al target
本文首次提出使用磁控溅射法制备瞬间液相连接的中间层。一种是直接沉积法，另一种是溅射去除氧化膜再沉积法。 |
| 3. | However the welding property of al mmcs is poor , it ' s difficult to obtain high joint strength . the application of al mmcs has been restricted by the low joint strength
但是铝基复合材料的焊接性能差，很难形成高强度的接头，成为该种材料走向实用化的严重障碍。 |
| 4. | Inlaid target sputtering to remove oxide scale on surface of al mmcs at first , then another copper target sputtering , copper film was deposited on the inlaid target
研究了磁控溅射法在待连接表面沉积中间层的工艺参数以及不同的中间层制备方法对tlp连接接头组织和性能的影响。 |
| 5. | In order to apply the al mmcs into industry , it ' s necessary to study the reliable bonding technology . it ' s paramount significance to investigate the bonding method of sicp / 6061al mmcs
为使其获得更广泛的工业应用，迫切需要开发实用可靠的连接技术，所以研究碳化硅颗粒增强铝基复合材料的连接具有重要的意义。 |
| 6. | Aluminum based metal matrix composite ( al mmcs ) materials with sic particle reinforced as excellent capability engineering materials have high strength , good wear resistance , excellent elevated temperature , high stiffness
碳化硅颗粒增强铝基复合材料作为性能优良的新一代工程结构材料，具有高比强度、比模量、耐高温、耐腐蚀等一系列的优点。 |
| 7. | The particle segregation in the joint region has n ' t been observed when tlp bonding of al mmcs using 10 m thickness copper foil , according with the theory of z . li . the effect of joint property is the oxidation on surface of the ai mmcs
Li等人在研究瞬间液相连接铝基复合材料的接头颗粒偏聚现象和机械性能时指出，采用合适的中间层厚度可以有效防止接头区域颗粒偏聚现象。 |
| 8. | Effects of parameters ( pressure , temperature , holding time ) of tlp bonding of al mmcs on the joint shear strength have been studied . experimental and theoretical basis for joint with excellent mechanical properties have been provided
研究了瞬间液相连接时，压力、连接温度、保温时间等工艺参数对接头组织和性能的影响规律，为能实现碳化硅颗粒增强铝基复合材料的良好连接打下理论基础并提供实验依据。 |
| 9. | Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering , tlp bonding of al mmcs with these interlays , the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil . removing the oxidation on the surface before deposition , copper was coated by magnetron sputtering as tlp bonding interlayer
待连接表面通过磁控溅射法沉积铜膜作为中间层进行瞬间液相连接，得到的接头强度与铜箔中间层进行瞬间液相连接得到的接头强度相当，而使用磁控溅射法去除待连接表面氧化膜后沉积铜膜作为中间层进行瞬间液相连接的接头强度提高7 . 6左右。 |
